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Ensuring large die durability in AI and HPC advanced packages

Protection is performance-critical, processability is production-vital. Discover how Henkel material ensures large, complex die durability in advanced packaging for AI and HPC applications.

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The rapid advancements in artificial intelligence (AI) and high-performance computing (HPC) have underscored the critical role of advanced semiconductor packaging. Over the past decade, substantial progress in 2.5D and 3D heterogeneous integration has been achieved, enhancing I/O capacity, performance, cost-efficiency, power reduction, and signal speed. These developments have been crucial for handling massive data processing demands. As these technologies evolve, ensuring the reliability and protection of increasingly large and complex die within these packages has become paramount.

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This whitepaper discusses:

Challenges of large die packages
Importance of die protection
Innovations in underfill materials
Introduction of Loctite Eccobond UF9000AE

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Ensuring large die durability in AI and HPC advanced packages

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