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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Part no. (SKU/IDH):
1859304

IDH Name:
LOCTITE® ECCOBOND NCP 5209, 10 cc

Electrically non-conductive adhesives

LOCTITE® ECCOBOND NCP 5209

Non-conductive, pre-applied underfill adhesive for thermal compression

This yellow non-conductive die-attach adhesive is designed for thermal compression bonding processes in flip-chip to laminate assembly.

Marketing materials

Part no. (SKU/IDH):
1859304

IDH Name:
LOCTITE® ECCOBOND NCP 5209, 10 cc

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

LOCTITE® ECCOBOND NCP 5209 is a pale yellow, acrylate-based, non-conductive die-attach adhesive for advanced flip-chip Cu pillar applications. It leverages thermal compression bonding for robust bump protection. It is compatible with small assembly gaps and tight pitches and is typically used as a pre-applied underfill to provide optimal fluxing activity for good solder joint formation. It cures fast when exposed to heat.

  • Product category:
  • Electrically non-conductive adhesives

Technologies:

  • Coefficient of thermal expansion (CTE), Above Tg:
  • 80.0 ppm/°C

 

  • Coefficient of thermal expansion (CTE), Below Tg:
  • 28.0 ppm/°C

 

  • Extractable ionic content, Chloride (CI-):
  • 10.0 ppm

 

  • Extractable ionic content, Potassium (K+):
  • 10.0 ppm

 

  • Extractable ionic content, Sodium (Na+):
  • 10.0 ppm

 

  • Glass transition temperature (Tg):
  • 145.0 °C

 

  • Storage modulus, DMA, @ 25.0 °C:
  • 7.3 GPa (7300.0 N/mm², 1058775.0 psi)

 

  • Storage temperature:
  • -40.0 °C

 

  • Viscosity, @ 25.0 °C:
  • 12500.0 mPa·s (cP)

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

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