Part no. (SKU/IDH):
1616623
IDH Name:
LOCTITE® ABLESTIK ABL 2100A, Syringe
Electrically conductive adhesives
Die attach adhesive designed for lead-free array packaging
This die attach adhesive is specially designed for Pb-free array packaging. It has high hot/wet adhesion and excellent dispensing characteristics.
Part no. (SKU/IDH):
1616623
IDH Name:
LOCTITE® ABLESTIK ABL 2100A, Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® ABLESTIK ABL 2100A die attach adhesive is designed for Pb-free array packaging. It can withstand the high reflow temperatures necessary for Pb-free solders @ 260°C (500°F). It is suitable for die sizes up to 12.7 x 12.7 mm (0.5” x 0.5”), and has ultra-low moisture absorption.
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Ultra-low moisture absorption
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Pb-free applications
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High hot/wet adhesion
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Excellent dispensing characteristics
- Product category:
- Electrically conductive adhesives
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 65.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 200.0 ppm/°C
- Cure type:
- Heat cure
- Glass transition temperature (Tg):
- 60.0 °C
- Thermal conductivity:
- 1.2 W/mK
- Thixotropic index:
- 5.3
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 9000.0 mPa·s (cP)
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