Part no. (SKU/IDH):
1189682
IDH Name:
LOCTITE® ABLESTIK 104 MOD2, Pail
Electrically non-conductive adhesives
Solvent-free epoxy for multi-substrate component assembly
This solvent- and volatile-matter-free, 2-part epoxy is ideal for assembling multi-substrate components at temperatures up to 290°C (554°F).
Part no. (SKU/IDH):
1189682
IDH Name:
LOCTITE® ABLESTIK 104 MOD2, Pail
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® ABLESTIK 104 MOD2 is a 2-part epoxy for component assembly. It contains no solvents or volatile matter and is suitable for bonding a wide variety of porous or non-porous materials. It may be used at temperatures up to 290°C (554°F) for short periods or intermittent use. This product can be cured at various temperatures. Ideal for aluminum, stainless steel, carbon steel, brass, ceramics, glass and thermoset plastic.
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Solvent free
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2-part: mixing required
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Multi-substrate adhesion
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Operating temperature up to 290°C (554°F) for short periods or intermittent use
- Product category:
- Electrically non-conductive adhesives
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